Electronic Modules & Packaging

Interplex offers complete solutions from concept through development and into scalable high-volume production of electronic modules for almost any electronic packaging application. Our dedicated team of engineers develop innovative solutions that fit the manufacturing needs of our valued customers and then match up those needs with the most suitable Interplex production facility.

Today, we continue to expand our technologies and capabilities from developing solutions for high-speed data and micro-electronic packaging requirements to high-current, thermally efficient packaging for power generation and conversion in electronic module applications such as radio frequency power and hybrid technologies.

Types of Applications

  • Component holders
  • Ceramic interconnects
  • Micro-electronics
  • Power modules
  • Radio frequency, hybrid, converters and solar devices
  • Semiconductor packages
  • Sensor enclosures
  • Tire Pressure Monitor System (TPMS) Sensors
  • Ultraviolet and light detectors

Markets Served

  • Automotive
  • Industrial
  • Medical & Life Sciences
  • White Goods

Types of Packages Available

Die and Wire-bondable Electronic Packaging
  • Ductile thermal heat spreaders
  • Metal or plastic die paddles
  • Motor controllers
  • Power electronics
  • Power lead frames
  • Reel-to-reel options
  • Sensor connectors
  • Wire-bondable platings (Ag, Ni, Pd, Au, NiP)
Semiconductor Electronic Packaging
  • Concentrator photovoltaics solar
  • Copper base flange technology
  • High power
  • High temperature liquid-crystal polymer plastic
  • LED
  • Metal or plastic die paddle
  • Microelectromechanical systems
  • Multi-chip
  • Photonic
  • Pressure and motion
  • Radio frequency power
  • Reel-to-reel options
  • Surface mount technology (SMT), through-hole
  • Ultraviolet detectors
  • Wire-bondable
Solder-bearing Interconnect Products
  • Ceramic interconnects
  • Coefficient of thermal expansion mismatch compliant
  • Connectors
  • Large variety of solder types
  • Memory modules
  • Micro-electronics
  • Multichip modules
  • Reel-to-reel for automation
  • Sensor applications
  • Zip, system-in-package, zig-zag configurations
PCB Interface, Press-Fit and Bondable Electronic Packaging
  • Bobbin assemblies
  • Capacitor holders
  • Continuous plastic enclosures and component holders
  • Controllers
  • Custom and select plating options
  • Flex circuit assemblies
  • High-current options
  • High temperature alloys and plastic options
  • I/O connector options
  • Intake manifold
  • Metal etched and stamped options
  • Motor drivers
  • Position sensors
  • Pressure sensors
  • Press-Fit technology
  • Reel-to-reel
  • Relays
  • Starters
  • SMT or connector interface
  • Telecom jacks
  • TPMS sensors
  • Tuning forks and sockets
  • Wire-bondable connections
Engineering and Development
  • Application expertise and design assistance
  • Design validation and product development
  • Design for global manufacturing
  • Finite Element Analysis evaluation
  • Packaging integration
  • Production tool design and build
  • Quick turn prototypes

Gallery