Solder Attach Technology
Over many years, solder attach technology, pioneered by Interplex, has been incorporated into a wide range of interconnects and other products by creating leads with a very precise amount of solder and flux already on them.
By considering the use of solder attach methods early in the design process, engineers can greatly expand their options for achieving product design and manufacturability objectives. Solder attach methods can be incorporated directly into the creation of virtually any application-specific components to make them “self-solderable”. This approach eliminates secondary processes and streamlines the assembly process, while also improving final product quality.
Our solder-bearing and flux-bearing products have proven to deliver 100% solderability while eliminating expensive and variable secondary processes, thereby improving quality while simultaneously reducing costs.
Building on these fundamental proven solder attach technologies in combination with our internal design expertise and vertically integrated manufacturing capabilities, Interplex also provides custom from-the-ground-up designs to deliver 100% solderability and cost reduction within a widening range of application-specific product implementations.
The flexibility of solder attach technologies, combined with Interplex’s global footprint and custom stamping capabilities, makes this technology an ideal alternative for creating any new custom applications that require joining of components within tight tolerances at competitive costs while providing high reliability.
Interplex self-soldering solutions are key enablers in a multitude of end applications, as shown below.
Types of Applications
- Automotive electronics
- Datacom & Telecom devices
- Display panels
- Lead frames
- Medical & Life Sciences devices
- Radio frequency shielding