Establishes solderless electro-mechanical board-to-board connection in EPS ECU.
Resources
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- New Hybrid Design 0.4mm Press-Fit Interconnects Enable Higher Density Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
