New IndiCoat™ Whisker Mitigation Electroplating Technology
2 July 2020
Interplex, a leading provider of customized application solutions, has announced today, the availability of the new IndiCoat™ – a whisker mitigation electroplating technology.
Interplex has completed accelerated life testing of IndiCoat™. Featuring the new acidic indium electroplating product designed to produce a uniform satin-matte indium finish that has low friction, excellent electrical and thermal conductivity, low melting point, and the capability of forming strong welding with many metals and alloys.
Tin whiskers pose electrical reliability risks in the form of potential short circuits. IndiCoat™ was developed as a whisker mitigating plating chemistry to supplement or replace existing tin-based chemistry.
IndiCoat™ was introduced in Interplex’s customizable Press-Fit components, creating a unique application to meet the challenging demands of the automotive market.
“Our advanced IndiCoat™ electroplating technology has enhanced the reliability of interconnectors for the automotive connector parts. With over 0.5 billion parts shipped at the initial launch, we are confident about our anti-whiskering technology for the automotive industry”, says C.Nantha Kumar, Vice President, Global Operations – Plating.
IndiCoat™ is available in high-speed reel-to-reel plating for large production volumes and supports plating on thin and thick layers.
Evelyn Wee firstname.lastname@example.org
Interplex is the world’s leading customized interconnect, high-precision and mechanical solution provider focused on megatrends such as Electrification of Transportation, Medical/Life Science, Cloud Infrastructure and General Industrial. Our unique product offering is unmatched in the industry. Our multi-disciplinary skills span from electro-mechanical to mechanical customized solutions.
Technology and innovation define us; customization sets us apart. With over 60 years of expertise, industry leaders trust us to design, develop and produce best-fit solutions for optimal manufacturability and industrialization, and to their exacting end-application specifications. Our global footprint spans 25+ locations across 13 countries and 10 R&D centers enabling us to work closely with customers to truly provide Any solution, Anywhere™.