INTERCONNECT TECHNOLOGY
PRESS-FIT
HIGH PERFORMANCE
IN HARSH, HIGH
TEMPERATURE ENVIRONMENTS
EXCELLENT THERMAL PERFORMANCE
High normal force interface enables movement to accommodate CTE mismatch, thereby providing excellent performance during high temperature cycling conditions
EXCELLENT THERMAL PERFORMANCE
High normal force interface enables movement to accommodate CTE mismatch, thereby providing excellent performance during high temperature cycling conditions
ROBUST CONNECTIONS
Strong, solder-free, repeatable, and highly reliable interfaces with high normal forces
ROBUST CONNECTIONS
Strong, solder-free, repeatable, and highly reliable interfaces with high normal forces
WHISKER MITIGATION OPTION
IndiCoat™, whisker mitigation electroplating technology, as a finishing option for our customizable Press-Fit components.
WHISKER MITIGATION OPTION
IndiCoat™, whisker mitigation electroplating technology, as a finishing option for our customizable Press-Fit components.
Watch Cell-PLX™ Come Alive:
AUTOMOTIVE-COMPLIANT
ENABLER
OUR CORE
PRODUCT LINES
| Product Family | Interplex Press-Fit Type | Picture | Finished PCB Hole Diameter (mm) | Insertion Force1 | Push-out Force1,2 |
|---|---|---|---|---|---|
|
Mini |
0.4 miniPLX |
 |
Ø0.55 - 0.65 |
≤ 100 N |
≥ 15 N |
|
Mini |
0.4 miniEON |
 |
Ø0.55 - 0.65 |
≤ 70 N |
≥ 15 N |
|
Signal |
0.4 EON |
 |
Ø0.75 - 0.83 |
≤ 70 N |
≥ 15 N |
|
Signal |
0.64 EON |
 |
Ø1.0 - 1.1 |
≤ 100 N |
≥ 30 N |
|
Power |
0.8 EON |
 |
Ø1.45 - 1.55 |
≤ 180 N |
≥ 60 N |
|
High Power |
1.2 EON |
 |
Ø2.0 - 2.1 |
≤ 180 N |
≥ 60 N |
2After storage at room temperature for ≥24 hours
OUR PRESS-FIT
TECHNOLOGY
Solderless Press-Fit Terminals for Automotive Applications
This technology supports the assembly of a terminal or electrical lead with a PCB plated-through hole, where an electrical connection is created and maintained without the application of solder.
Custom Connectors with Press-Fit Terminals
Our Press-Fit technology is used in connectors and headers that make custom interconnects directly from the PCB to a mating connector.
Press-Fit Module and Sensor Enclosures
Manufacturers utilize our solderless Press-Fit technology in a variety of control modules and sensors. Our technology helps customers design-in low-cost, high-quality products by seamlessly integrating the complete connection system into the enclosure package, eliminating the need for secondary soldering operations.
Press-Fit Module and Sensor Enclosures
Manufacturers utilize our solderless Press-Fit technology in a variety of control modules and sensors. Our technology helps customers design-in low-cost, high-quality products by seamlessly integrating the complete connection system into the enclosure package, eliminating the need for secondary soldering operations.
Card Edge SMT Press-Fit Connector System
Interplex’s SMT card edge connector system employs a discrete SMT component, creating a solderless Press-Fit card edge connector system for daughter card applications. It uses Interplex-tested and proven 0.4mm or 0.64mm Press-Fit technology. Automotive manufacturers utilize Press-Fit technology in control modules, switches, fuse receptacles, junction boxes, hybrid inverters, a myriad of sensor and connector applications, and other engine and passenger compartment applications. Our solderless Press-Fit technology is fully tested to meet the automotive industry’s stringent operating requirements for vibration and temperature.
APPLICATIONS WITH
PRESS-FIT TERMINALS
Solderless Press-Fit Terminals for Automotive Applications
Custom Connectors with Press-Fit Terminals
Custom Molded Modules and Power Lead Frames
Card Edge SMT Press-Fit Connector System
INTERPLEX PRODUCTS
WITH PRESS-FIT TECHNOLOGY
CONTACT US
* Denotes a required field
