Over our long history of creating new process technologies and applying them to solve real-world applications, engineering and manufacturing challenges, Interplex has also developed an extensive library of resources to help our customers.
Whether your objective is to understand the processes, parameters, techniques and benefits of a particular technology area or help make a best-fit decision for solving a specific design challenge – you can find answers here.
Automotive Press-Fit Solderless Interconnects
Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.
Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.
Electronic Modules and Packaging Solutions
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.
Flex Circuit Assembly with Custom Connector Solutions
From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.
Open Cavity Thermoplastic Packaging Solutions
For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.
Solderless Capacitor Mount System - CAP-Loc™ System
A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.
Solderless Press-Fit Terminals for Automotive Applications
Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.