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Technical Bulletins

Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs

Integrated Thermal Management Solutions with Customizable and Manufacturable Heat Sinks Overview Thermal management of electronic devices has always been a key issue for assuring proper operation and sustainable performance across a wide range of ambient temperatures and operating conditions. Over recent years, the issues surrounding thermal management have become even more challenging, with high-current applications […]

Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs Read More »

Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies

Uncategorized / Interplex

Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies Read More »

Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules

Uncategorized / Interplex

Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules Read More »

Busbar Connectivity and Integration – A Critical Element for Power Applications

Uncategorized / Interplex

Busbar Connectivity and Integration – A Critical Element for Power Applications Read More »

Metallurgy-based Failure Analysis Plays Key Role in Design and Manufacturing

Uncategorized / Interplex

Failure Analysis Plays Key Role in Design and Manufacturing Advanced Metallurgy Testing Can Identify and Resolve Issues Early Overview The majority of today’s product manufacturing scenarios involve metal — either in the products themselves and/or the tooling used to create them. Unsurprisingly, metallurgy-based failure analysis is an important consideration for assuring both product quality and

Metallurgy-based Failure Analysis Plays Key Role in Design and Manufacturing Read More »

Outsourcing Subassembly Design-to-Production Offers Time to Market Advantages and Cost Savings

Uncategorized / Interplex

Outsourcing Subassembly Design-to-Production Offers Time to Market Advantages and Cost Savings Read More »

Enabling Next-Gen Power Applications With Improved Packaging Efficiency

Uncategorized / Interplex

Enabling Next-Gen Power Applications With Improved Packaging Efficiency Read More »

Chemical Etching Offers Unmatched Strength and Fine-mesh Capabilities for Advanced Fluid Filtration Applications

Uncategorized / Interplex

Chemical Etching Offers Unmatched Strength and Fine-mesh Capabilities for Advanced Fluid Filtration Applications Read More »

Chemical Etching Provides the Solution for Micro-Features and Ultra-Close Tolerances

Uncategorized / Interplex

Chemical Etching Provides the Solution for Micro-Features and Ultra-Close Tolerances Read More »

Advanced Interconnect Designs to Optimize High-Mix Production Environments

Uncategorized / Interplex

Advanced Interconnect Designs to Optimize High-Mix Production Environments Read More »

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Technical Bulletins

Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs

Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies

Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules

Busbar Connectivity and Integration – A Critical Element for Power Applications

Metallurgy-based Failure Analysis Plays Key Role in Design and Manufacturing

Outsourcing Subassembly Design-to-Production Offers Time to Market Advantages and Cost Savings

Enabling Next-Gen Power Applications With Improved Packaging Efficiency

Chemical Etching Offers Unmatched Strength and Fine-mesh Capabilities for Advanced Fluid Filtration Applications

Chemical Etching Provides the Solution for Micro-Features and Ultra-Close Tolerances

Advanced Interconnect Designs to Optimize High-Mix Production Environments

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