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Automotive Press-Fit Solderless Interconnects

Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.

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Bandolier Pins

Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.

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Bipolar Plates for Fuel Cells

Bipolar Plates for Fuel Cells- the heart of Hydrogen conversion into electric power. Green technology for various applications in the transportation and energy industries.

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BusMate™ Power Busbar Connector System

Busbar-pluggable power interconnect for low and high voltage applications. Excellent ampacity-size ratio and accommodates large assembly tolerances.

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Cell-PLX™ EV Battery Interconnect System

Electric Vehicle battery module interconnect system customizable to your requirements. Adaptable for various cell quantities and configurations with integrated control board connector and pluggable multi-module expansion capability.

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Customized Connectors

Design and development of interconnect solutions- our passion and forte. Discover our comprehensive range of customized connectors for various end applications, and the capabilities we have to provide you with Any solution, Anywhere™.

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Electronic Modules and Packaging Solutions

Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.

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Flex Circuit Assembly with Custom Connector Solutions

From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.

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Flexible Busbars

Customized flexible busbars for low voltage power applications. Excellent vibration and shock absorption characteristics with improved electrical conductivity and high tolerance for assembly mismatch/offset.

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Heat Sinks

Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.

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IndiCoat™ Whisker Mitigation Plating Chemistry

Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.

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Mechatronics Packaging Interconnect Solutions

Customizable solutions with integrated pluggable sub-assemblies; suitable for high and low voltage power applications.

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Open Cavity Thermoplastic Packaging Solutions

For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.

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Plating Capabilities

Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.

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Plating Research and Development Centre

Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.

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Press-Fit Technology

Your trusted solderless connection in various sizes, materials, plating options and delivery formats.

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Solderless Capacitor Mount System – CAP-LOC™ System

A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.

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Solderless Press-Fit Terminals for Automotive Applications

Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.

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