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Solder and Flux Bearing Leads Catalogue

The Interplex Solder and Flux Bearing Leads Catalogue is available in a web version or in a downloadable format. To access the documentation, select the product drawing you are interested in.

Ordering Information

Interplex NAS Part Numbering Code

Lot Sizes

Type Pitch Gap Other Lot Size
A = DIP .100 [2.54] All 30,000
0.75 [1.905] All 30,000
.05 [1.27] All 07AA Only 36,000
.05 [1.27] All 21CA Only 50,000
B = SIP .100 [2.54] .000 [0.00] – .022 [0.56] 32,000
.023 [0.58] – .03 [0.77] 30,000
.031 [0.79] and above 24,000
All .017 [0.43] thick 24,000
.075 [1.905] All 36,000
.05 [1.27] .000 [0.00] – 0.03 [0.77] 50,000
.031 [0.79] and above 36,000
C = SMT .020 [0.58] All 125,000
.025 [0.64] All 100,000
.040 [1.02] All 50,000
.050 [1.27] All 50,000
.100 [2.54] All 25,000
D = SCI .100 [2.54] .000 [0.00] – 0.022 [0.56] 32,000
.023 [0.58] – .030 [0.77] 30,000
.031 [0.79] and above 24,000
All .017 [0.43] thick 24,000
.075 [1.905] All 36,000
.05 [1.27] .000 [0.00] – 0.03 [0.77] 50,000
.031 [0.79] and above 36,000
F = THI Solder 36,000
Non-solder 40,000
SPECIAL .125 [3.175] All 1457 – 1458 only 28,000
.100 [2.54] None Non-solder 100,000
.100 [2.54] None Solder 100,000
.075 [1.905] None Solder 100,000
0.050 [1.27] None Solder 150,000
0.050 [1.27] All 07EA only 50,000

Recommended Pad Sizes

The pad sizes below are for reference only. Actual pad size may vary by the types of pin selected and the specific application.

SIP, DIP & SMT

THI (Through Hole Interconnect)

Pitch

SIP, DIP, SMT Press-Fit
A B C D E F
.100 [2.540] .080 [2.030] .060 [1.520] .070 [1.780] .055 [1.400] .038 [0.970]
.075 [1.905] .080 [2.030] .060 [1.520]
.050 [1.270] .060 [1.520] .035 [0.910]
.040 [1.020] .050 [1.270] .018 [0.450]
.025 [0.635] .013 [0.330]
.020 [0.508]

Substrate Thickness or Gap Size

The clip opening or gap is indicated by “G” on our drawings. The gap in the part is always smaller than the substrate thickness. Listed in the table below are some of the common substrate thickness and the corresponding gaps. The actual gaps available for each part are indicated below each drawing.

Substrate Thickness Gap Gap Code
Inches ± .002 mm ± .05 Inches ± .002 mm ± .05
.005 .13 .002 .05 02
.015 .38 .012 .31 12
.022 .56 .018 .45 18
.025* .64 .022 .56 22
.030 .77 .026 .66 26
.035 .89 .032 .81 32
.040* 1.02 .036 .91 36
.045 1.14 .041 1.04 41
.050* 1.27 .046 1.17 46
.060* 1.52 .056 1.42 56
.064 1.53 .060 1.52 60
.080* 2.03 .072 1.83 72

*Recommended gaps. More gaps are available upon request.

Technical Data

Solder and Flux Types

Code Alloy Melting Temperature
Soldius ˚F Soldius ˚C Liquidus ˚F Liquidus˚C
O Non-solder
A Sn60 Pb40 Solid No Flux 361 183 370 188
B Sn60 Pb40 Flux Type No Clean 361 183 370 188
C Sn60 Pb40 Flux Type RMA Mild Active 361 183 370 188
E Sn10 Pb90 Solid No Flux 514 268 576 302
F Sn10 Pb90 Flux Type No Clean 514 268 576 302
G Sn10 Pb90 Flux Type RMA Mild Active 514 268 576 302
I Sn62 Pb36 Ag2 Solid No Flux 354 179 354 179
J Sn62 Pb36 Ag2 Flux Type No Clean 354 179 354 179
K Sn62 Pb36 Ag2 Flux Type RMA Mild Active 354 179 354 179
M* Sn96 Ag4 Solid No Flux 430 221 430 221
N* Sn96 Ag4 Flux Type No Clean 430 221 430 221
W* Sn96 Ag4 Flux Type RMA Mild Active 430 221 430 221
Q Sn10 Pb88 Ag2 Solid No Flux 514 268 576 302
R Sn10 Pb88 Ag2 Flux Type No Clean 514 268 576 302
S Sn10 Pb88 Ag2 Flux Type RMA Mild Active 514 268 576 302
U Sn63 Pb37 Solid No Flux 361 183 361 183
V Sn63 Pb37 Flux Type No Clean 361 183 361 183
Y Sn63 Pb37 Flux Type RMA Mild Active 361 183 361 183
1* Sn96.5 Ag3 Cu0.5 Solid No Flux 424 218 424 218
2* Sn96.5 Ag3 Cu0.5 Flux Type No Clean 424 218 424 218
3* Sn96.5 Ag3 Cu0.5 Flux Type RMA Mild Active 424 218 424 218

*RoHS Complaint

Reflow Methods

Some of the suggested reflow methods are:

  • Hot Bar
  • Hot Air
  • Hot Gas
  • Thermode
  • Laser
  • Infrared
  • Vapor Phase

Selective Plating Capabilities

Our unique design allows us to change efficiently from control depth plating to selective area plating without costly changeover times. We offer our customers a variety of quality plated finishes, such as gold, silver, palladium, nickel, bright nickel, tin, bright tin, lead and copper.

Material Selection for Hybrid and Chip Carrier Chips

The evolution of hybrid and chip carrier technology has created the need for an effective interconnection scheme. The solution that has been developed is the edge clip. However, there is a wide variety of edge clips available today. In addition to both solder and non-solder bearing types, designs available are as varied as the devices they can be applied to.

Besides the consideration of solder bearing types and designs, a wide range of materials can be used to manufacture edge clips. All of these have led to confusion as to which is the best clip or material combination to use in a specific application.

The three basic factors which affect material selection are:

  1. Mechanical
  2. Electrical
  3. Thermal

The types of materials commonly used are:

  1. Copper
  2. Beryllium Copper
  3. Brass
  4. Bronze
  5. Phosphor Bronze
  6. Lead frame materials (Kovar and F42 A alloy)

If you need a complete report detailing the peel/shear tests and to review the key factors in material selection, please contact us.

Reel Orientation

DIP / SMT / SCI / THI

SIP

Product Drawings

Discover Interplex Solder and Flux Bearing Leads with the available product drawings below. You may view the information online, downloaded or printed.

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