BusMate® Pluggable Busbar Connector Technology Streamlines Motion Control & EPS Motor Integration
BusMate® combines a small footprint to conserve PCB space with a large ampacity-to-size ratio for handling increasing power densities. To accommodate a range of applications, BusMate® power couplers are available in SMT format or proven eye-of-the-needle solderless Press-Fit interfaces.
Robust Electrical Performance, Ease of Assembly and Configuration Flexibility
BusMate® ensures low and stable contact resistance while allowing for wide positional tolerance of the mating blade in all three axes. Interplex’s Floating Contact Technology assures consistent high-power coupling by automatically compensating for variations in blade alignment.
BusMate’s pluggable Floating Contact Technology can accommodate large assembly tolerances of +/- 8mm offset and up to +/- 16 degrees of twist. In addition, it can handle a range of insertion depths and accommodate up to three re-mating cycles with no loss of performance.
BusMate® Enables Improved Design and Production for Motion Control Applications
Some of the key use cases for BusMate® are in automotive motion control assemblies, including Electronic Power Steering (EPS) and other motor integration requirements.
BusMate’s compact size and small PCB footprint enable a variety of applications-specific configuration scenarios, such as using separate BusMate® connectors for each phase in a multi-phase motor design (as shown below).
Designed for Applications-Specific Configurability
Most motor control applications include four main subassemblies that need to come together to make a system. These can be either parallel stacking or perpendicular depending on the design. The following model shows the parallel stacking option.
I/O connector assembly with Integrated Filter
Typically uses a lead-frame based design with molded and over molded assembly that integrates both I/O connectors and choke and capacitors to make up the filter assembly.
Usually consists of a high-density SMD PCB with various components and is the brain of the assembly. This typically interfaces to the I/O assembly with connectors or with integrated press fit technology.
This contains the power switching chips like Mosfet or IGBT’s along with the supporting parts that drives the motor. This is mostly a SMD PCB and is where B BusMate® technology is key. BusMate® can be used as an interface to control the PCB and/or sometimes can directly accept a power lead all the way through the assembly from the I/O. This is where the misalignment auto-adjust Floating Contact Technology becomes very beneficial. On the other side the BusMate® is utilized as the interface between the power PCB and the Motor phase inputs.
The three subassemblies above are all built as one assembly that is traditionally called the Power Pack. Then the Power Pack is directly plugged on to the motor.
BusMate® automatically compensates for phase terminal misalignment to the Power Pack while also being small enough to allow for a very low profile stacking in the assembly of the motor.
As power systems and modules in the automotive industry become more complex and power densities increase, the need to integrate a variety of functions and minimize size while improving power efficiency will be critical for success.
A high degree of configuration flexibility, combined with compact size, high power density and cost-effective volume manufacturing make BusMate® a logical choice for use across the widening range of power connectivity requirements in both current and emerging application areas.