Interplex NAS Part Numbering Code

Lot Sizes

Type	Pitch	Gap	Other	Lot Size
A = DIP	.100 [2.54]	All		30,000
	0.75 [1.905]	All		30,000
	.05 [1.27]	All	07AA Only	36,000
	.05 [1.27]	All	21CA Only	50,000
B = SIP	.100 [2.54]	.000 [0.00] - .022 [0.56]		32,000
		.023 [0.58] - .03 [0.77]		30,000
		.031 [0.79] and above		24,000
		All	.017 [0.43] thick	24,000
	.075 [1.905]	All		36,000
	.05 [1.27]	.000 [0.00] - 0.03 [0.77]		50,000
		.031 [0.79] and above		36,000
C = SMT	.020 [0.58]	All		125,000
	.025 [0.64]	All		100,000
	.040 [1.02]	All		50,000
	.050 [1.27]	All		50,000
	.100 [2.54]	All		25,000
D = SCI	.100 [2.54]	.000 [0.00] - 0.022 [0.56]		32,000
		.023 [0.58] - .030 [0.77]		30,000
		.031 [0.79] and above		24,000
		All	.017 [0.43] thick	24,000
	.075 [1.905]	All		36,000
	.05 [1.27]	.000 [0.00] - 0.03 [0.77]		50,000
		.031 [0.79] and above		36,000
F = THI	Solder			36,000
	Non-solder			40,000
SPECIAL	.125 [3.175]	All	1457 - 1458 only	28,000
	.100 [2.54]	None	Non-solder	100,000
	.100 [2.54]	None	Solder	100,000
	.075 [1.905]	None	Solder	100,000
	0.050 [1.27]	None	Solder	150,000
	0.050 [1.27]	All	07EA only	50,000

Recommended Pad Sizes

The pad sizes below are for reference only. Actual pad size may vary by the types of pin selected and the specific application. Pitch

SIP, DIP, SMT					Press-Fit
A	B	C	D	E	F
.100 [2.540]	.080 [2.030]	.060 [1.520]	.070 [1.780]	.055 [1.400]	.038 [0.970]
.075 [1.905]	.080 [2.030]	.060 [1.520]
.050 [1.270]	.060 [1.520]	.035 [0.910]
.040 [1.020]	.050 [1.270]	.018 [0.450]
.025 [0.635]		.013 [0.330]
.020 [0.508]

Substrate Thickness or Gap Size

The clip opening or gap is indicated by “G” on our drawings. The gap in the part is always smaller than the substrate thickness. Listed in the table below are some of the common substrate thickness and the corresponding gaps. The actual gaps available for each part are indicated below each drawing.

Substrate Thickness		Gap		Gap Code
Inches ± .002	mm ± .05	Inches ± .002	mm ± .05
.005	.13	.002	.05	02
.015	.38	.012	.31	12
.022	.56	.018	.45	18
.025*	.64	.022	.56	22
.030	.77	.026	.66	26
.035	.89	.032	.81	32
.040*	1.02	.036	.91	36
.045	1.14	.041	1.04	41
.050*	1.27	.046	1.17	46
.060*	1.52	.056	1.42	56
.064	1.53	.060	1.52	60
.080*	2.03	.072	1.83	72

*Recommended gaps. More gaps are available upon request.

Solder and Flux Types

Code	Alloy	Melting Temperature
		Soldius ˚F	Soldius ˚C	Liquidus ˚F	Liquidus˚C
O	Non-solder	-	-	-	-
A	Sn60 Pb40 Solid No Flux	361	183	370	188
B	Sn60 Pb40 Flux Type No Clean	361	183	370	188
C	Sn60 Pb40 Flux Type RMA Mild Active	361	183	370	188
E	Sn10 Pb90 Solid No Flux	514	268	576	302
F	Sn10 Pb90 Flux Type No Clean	514	268	576	302
G	Sn10 Pb90 Flux Type RMA Mild Active	514	268	576	302
I	Sn62 Pb36 Ag2 Solid No Flux	354	179	354	179
J	Sn62 Pb36 Ag2 Flux Type No Clean	354	179	354	179
K	Sn62 Pb36 Ag2 Flux Type RMA Mild Active	354	179	354	179
M*	Sn96 Ag4 Solid No Flux	430	221	430	221
N*	Sn96 Ag4 Flux Type No Clean	430	221	430	221
W*	Sn96 Ag4 Flux Type RMA Mild Active	430	221	430	221
Q	Sn10 Pb88 Ag2 Solid No Flux	514	268	576	302
R	Sn10 Pb88 Ag2 Flux Type No Clean	514	268	576	302
S	Sn10 Pb88 Ag2 Flux Type RMA Mild Active	514	268	576	302
U	Sn63 Pb37 Solid No Flux	361	183	361	183
V	Sn63 Pb37 Flux Type No Clean	361	183	361	183
Y	Sn63 Pb37 Flux Type RMA Mild Active	361	183	361	183
1*	Sn96.5 Ag3 Cu0.5 Solid No Flux	424	218	424	218
2*	Sn96.5 Ag3 Cu0.5 Flux Type No Clean	424	218	424	218
3*	Sn96.5 Ag3 Cu0.5 Flux Type RMA Mild Active	424	218	424	218

*RoHS Complaint

Reflow Methods

Some of the suggested reflow methods are:

• Hot Bar
• Hot Air
• Hot Gas
• Thermode
• Laser
• Infrared
• Vapor Phase

Selective Plating Capabilities

Our unique design allows us to change efficiently from control depth plating to selective area plating without costly changeover times. We offer our customers a variety of quality plated finishes, such as gold, silver, palladium, nickel, bright nickel, tin, bright tin, lead and copper.

Material Selection for Hybrid and Chip Carrier Chips

The evolution of hybrid and chip carrier technology has created the need for an effective interconnection scheme. The solution that has been developed is the edge clip. However, there is a wide variety of edge clips available today. In addition to both solder and non-solder bearing types, designs available are as varied as the devices they can be applied to. Besides the consideration of solder bearing types and designs, a wide range of materials can be used to manufacture edge clips. All of these have led to confusion as to which is the best clip or material combination to use in a specific application. The three basic factors which affect material selection are:

1. Mechanical
2. Electrical
3. Thermal

The types of materials commonly used are:

1. Copper
2. Beryllium Copper
3. Brass
4. Bronze
5. Phosphor Bronze
6. Lead frame materials (Kovar and F42 A alloy)

If you need a complete report detailing the peel/shear tests and to review the key factors in material selection, please contact us.

DIP / SMT / SCI / THI

SIP