Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.
Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.
Bipolar Plates for Fuel Cells- the heart of Hydrogen conversion into electric power. Green technology for various applications in the transportation and energy industries.
Busbar-pluggable power interconnect for low and high voltage applications. Excellent ampacity-size ratio and accommodates large assembly tolerances.
Electric Vehicle battery module interconnect system customizable to your requirements. Adaptable for various cell quantities and configurations with integrated control board connector and pluggable multi-module expansion capability.
Design and development of interconnect solutions- our passion and forte. Discover our comprehensive range of customized connectors for various end applications, and the capabilities we have to provide you with Any solution, Anywhere™.
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.
From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.
Customized flexible busbars for low voltage power applications. Excellent vibration and shock absorption characteristics with improved electrical conductivity and high tolerance for assembly mismatch/offset.
Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.
Our customized High Pin Count Header with open standard interface enables design flexibility and functionality. Ideal for applications with tight packaging, high pin count and high density requirements.
Suitable for heat dissipation of high-power components with tight packaging constraints. A low thermal resistance and cost-effective thermal management solution that is customizable to your end application needs.
Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.
Interplex specializes in customized applications solutions tailored to specific end-applications. Learn more about our global footprint, integrated full suite of capabilities, and the industries we excel in; discover how we can truly provide our valued customers with Any solution, Anywhere™.
Customizable solutions with integrated pluggable sub-assemblies; suitable for high and low voltage power applications.
Compact, robust and reliable 10-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.
Compact, robust and reliable 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.
Compact, robust and reliable non-magnetic 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.
Our robust Multi-Row Board-to-Board Connector is customizable to high circuit size, with board height flexibility. Up to 30 circuits per row and up to 6 rows.
For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.
Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.
Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.
Learn more about our portfolio of customized interconnect solutions for electric & hybrid vehicles, e-mobility and industrial high-power applications.
Electrical current carrying capacity data for Interplex’s 0.40mm MiniPLX, 0.64mm EON and 0.80mm EON Press-Fit zones.
Your trusted solderless connection in various sizes, materials, plating options and delivery formats.
Pluggable, solder-free, compact-sized Radar Interconnect with automotive approved Press-Fit pins.
Power lead frames with selective-bonded silver sinter for top side direct die attach. A stable and reliable solution with low inductance, low resistance and efficient heat dissipation.
Interplex’s Solder and Flux Bearing Lead has a consistency close to 100% and contain a precise predetermined amount of solder and flux.
Find drawings of our Solder and Flux Bearing Leads here.
Interplex’s Solder and Flux Bearing Technology eliminates costly and defect prone soldering methods and is an alternative for Press-Fits.
Find drawings of our Solder and Flux Bearing Technology here.
A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.
Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.
As a member of the SPE Industrial Partner Network, we are committed to supplying a range of SPE products, such as IEC 63171-6 compliant connectors and receptacles.
Our customized Stacked Fins Heat Sink is a reliable and cost-effective thermal management solution for high-powered forced air convection applications, while our Riveted Fins Heat Sink is ideal for automotive application with natural air convection.
Automotive
Forging
Interconnect & Busbars
Molding
Power
Press-Fit
Solder Bearing
Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.
Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.
Bipolar Plates for Fuel Cells- the heart of Hydrogen conversion into electric power. Green technology for various applications in the transportation and energy industries.
Busbar-pluggable power interconnect for low and high voltage applications. Excellent ampacity-size ratio and accommodates large assembly tolerances.
Electric Vehicle battery module interconnect system customizable to your requirements. Adaptable for various cell quantities and configurations with integrated control board connector and pluggable multi-module expansion capability.
Design and development of interconnect solutions- our passion and forte. Discover our comprehensive range of customized connectors for various end applications, and the capabilities we have to provide you with Any solution, Anywhere™.
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.
From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.
Customized flexible busbars for low voltage power applications. Excellent vibration and shock absorption characteristics with improved electrical conductivity and high tolerance for assembly mismatch/offset.
Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.
Our customized High Pin Count Header with open standard interface enables design flexibility and functionality. Ideal for applications with tight packaging, high pin count and high density requirements.
Suitable for heat dissipation of high-power components with tight packaging constraints. A low thermal resistance and cost-effective thermal management solution that is customizable to your end application needs.
Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.
Interplex specializes in customized applications solutions tailored to specific end-applications. Learn more about our global footprint, integrated full suite of capabilities, and the industries we excel in; discover how we can truly provide our valued customers with Any solution, Anywhere™.
Customizable solutions with integrated pluggable sub-assemblies; suitable for high and low voltage power applications.
Compact, robust and reliable 10-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.
Compact, robust and reliable 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.
Compact, robust and reliable non-magnetic 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.
Our robust Multi-Row Board-to-Board Connector is customizable to high circuit size, with board height flexibility. Up to 30 circuits per row and up to 6 rows.
For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.
Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.
Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.
Learn more about our portfolio of customized interconnect solutions for electric & hybrid vehicles, e-mobility and industrial high-power applications.
Electrical current carrying capacity data for Interplex’s 0.40mm MiniPLX, 0.64mm EON and 0.80mm EON Press-Fit zones.
Your trusted solderless connection in various sizes, materials, plating options and delivery formats.
Pluggable, solder-free, compact-sized Radar Interconnect with automotive approved Press-Fit pins.
Power lead frames with selective-bonded silver sinter for top side direct die attach. A stable and reliable solution with low inductance, low resistance and efficient heat dissipation.
Interplex’s Solder and Flux Bearing Lead has a consistency close to 100% and contain a precise predetermined amount of solder and flux.
Find drawings of our Solder and Flux Bearing Leads here.
Interplex’s Solder and Flux Bearing Technology eliminates costly and defect prone soldering methods and is an alternative for Press-Fits.
Find drawings of our Solder and Flux Bearing Technology here.
A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.
Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.
As a member of the SPE Industrial Partner Network, we are committed to supplying a range of SPE products, such as IEC 63171-6 compliant connectors and receptacles.
Our customized Stacked Fins Heat Sink is a reliable and cost-effective thermal management solution for high-powered forced air convection applications, while our Riveted Fins Heat Sink is ideal for automotive application with natural air convection.
Automotive
Forging
Interconnect & Busbars
Molding
Power
Press-Fit
Solder Bearing
Instruction For Use (IFU)
Get to know your Interplex solution better. The complete manual and IFU accompanying selected solutions are available for your reference.
Click here to view our list of available IFUs.
Click here to view our list of available IFUs.