Automotive Press-Fit Solderless Interconnects
Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.Bandolier Pins
Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.Bipolar Plates for Fuel Cells
Bipolar Plates for Fuel Cells- the heart of Hydrogen conversion into electric power. Green technology for various applications in the transportation and energy industries.BusMate® Power Busbar Connector System
Busbar-pluggable power interconnect for low and high voltage applications. Excellent ampacity-size ratio and accommodates large assembly tolerances.Cell-PLX™ Electric Vehicle Battery Interconnect System
Electric Vehicle battery module interconnect system customizable to your requirements. Adaptable for various cell quantities and configurations with integrated control board connector and pluggable multi-module expansion capability.Customized Connectors
Design and development of interconnect solutions- our passion and forte. Discover our comprehensive range of customized connectors for various end applications, and the capabilities we have to provide you with Any solution, Anywhere™.Electronic Modules and Packaging Solutions
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.Flex Circuit Assembly with Custom Connector Solutions
From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.Flexible Busbars
Customized flexible busbars for low voltage power applications. Excellent vibration and shock absorption characteristics with improved electrical conductivity and high tolerance for assembly mismatch/offset.Heat Sinks
Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.IndiCoat™ Whisker Mitigation Plating Chemistry
Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.Interplex Corporate Brochure
Interplex specializes in customized applications solutions tailored to specific end-applications. Learn more about our global footprint, integrated full suite of capabilities, and the industries we excel in; discover how we can truly provide our valued customers with Any solution, Anywhere™.Mechatronics Packaging Interconnect Solutions
Customizable solutions with integrated pluggable sub-assemblies; suitable for high and low voltage power applications.Medical Circular Connectors: 10-pin/socket
Compact, robust and reliable 10-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Medical Circular Connectors: 6-pin/socket
Compact, robust and reliable 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Medical Circular Connectors: 6-pin/socket (Non-magnetic)
Compact, robust and reliable non-magnetic 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Multi-Row Board-to-Board Connector
Our robust Multi-Row Board-to-Board Connector is customizable to high circuit size, with board height flexibility. Up to 30 circuits per row and up to 6 rows.Open Cavity Thermoplastic Packaging Solutions
For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.Plating Capabilities
Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.Plating Research and Development Centre
Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.Power Interconnect Solutions
Learn more about our portfolio of customized interconnect solutions for electric & hybrid vehicles, e-mobility and industrial high-power applications.Press-Fit Current Carrying Capacity Datasheet
Electrical current carrying capacity data for Interplex’s 0.40mm MiniPLX, 0.64mm EON and 0.80mm EON Press-Fit zones.Press-Fit Technology
Your trusted solderless connection in various sizes, materials, plating options and delivery formats.Sinter-PLX™ Sinter-bonded Power Lead Frame Technology
Power lead frames with selective-bonded silver sinter for top side direct die attach. A stable and reliable solution with low inductance, low resistance and efficient heat dissipation.Solder and Flux Bearing Leads Catalogue
Interplex’s Solder and Flux Bearing Lead has a consistency close to 100% and contain a precise predetermined amount of solder and flux. Find drawings of our Solder and Flux Bearing Leads here.Solder and Flux Bearing Technology
Interplex’s Solder and Flux Bearing Technology eliminates costly and defect prone soldering methods and is an alternative for Press-Fits. Find drawings of our Solder and Flux Bearing Technology here.Solderless Capacitor Mount System – CAP-LOC™ System
A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.Solderless Press-Fit Terminals for Automotive Applications
Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.SPE Connector with Press-Fit & SPE Plug
As a member of the SPE Industrial Partner Network, we are committed to supplying a range of SPE products, such as IEC 63171-6 compliant connectors and receptacles.Automotive
- Battery Module Manufacturers Need Robust High-speed Options for Collector Plate Attachment
- Custom Battery Interconnect Systems Streamline Design Manufacturing Battery Modules
- Customized Connectors for ECU Modules in Automotive Applications
- Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs
- Integrating Custom Connectors is a Key Enabling Factor for Next-Gen Automotive Sensor Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies
Forging
- Advantages of Cold Forging vs Casting Processes
- Advantages of Cold Forging vs Machining
- Advantages of Cold Forging vs Weldments and other Fabrication Processes
- Cold Forging – Achieving a Variety of Shapes and Design Flexibility
- Cold Forging Improves Production Efficiency for Automotive Drivetrain Components
- Cold Forging Technology Offers Key Advantages
- Cold Forging Technology Offers Superior Strength, Part Integrity and Material Utilization
- Precision Cold Forging Progressive Stamping Enables Cost Effective Production of Complex Parts
Interconnect & Busbars
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- High Power Multi-layer Molded Busbars: Design Considerations and Construction Options
- New Busbar Technologies Provide Flexibility for Expanding Range of Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
Molding
- Creating Cost-Effective Sensor Housings with Integrated Molding and Wire Bondable Plated Stampings
- Design Considerations for Molded Plastic Electronic Modules Using Press-Fit Technology
- Integration of Insert Molding Processes to Optimize Production of Plastic Modules for Electronics, Sensors and Medical Applications
Power
- Bipolar Plates and Their Critical Role in Fuel Cells
- Custom Battery Interconnect Systems Streamline Design Manufacturing Battery Modules
- Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs
- New Busbar Technologies Provide Flexibility for Expanding Range of Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies
Press-Fit
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Enabling Next-Gen Power Applications With Improved Packaging Efficiency
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- New Hybrid Design 0.4mm Press-Fit Interconnects Enable Higher Density Applications
- Next Generation High Density SMT Solderless Edge Card Connector System
- Optimizing Molded Plastic Electronic Modules With Advanced Press-Fit Technologies
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 1 Application Requirements
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 2 Specifications & Design Considerations
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
Solder Bearing
- Key Issues and Considerations for Implementing Solder Bearing Lead Applications
- New Solder Attach Technologies Streamline Assembly in Application-Specific Designs
- New Solder Ball Technology Provides Enhanced Co-planarity Compensation for Module & Mezzanine Applications
- Solder-Bearing “Claw” Design Edge Clips – Getting a Grip for 100% Solderability
- Solder-Bearing Flex Circuit Contacts Enable Precise Temperature Control, Increased Yields, Streamlined Production and Higher Quality Results
- Solder-Bearing RF Shields Streamline PCB Assembly, Reduce Costs, Improve Quality and Eliminate Signal Leakage
Automotive Press-Fit Solderless Interconnects
Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.Bandolier Pins
Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.Bipolar Plates for Fuel Cells
Bipolar Plates for Fuel Cells- the heart of Hydrogen conversion into electric power. Green technology for various applications in the transportation and energy industries.BusMate® Power Busbar Connector System
Busbar-pluggable power interconnect for low and high voltage applications. Excellent ampacity-size ratio and accommodates large assembly tolerances.Cell-PLX™ Electric Vehicle Battery Interconnect System
Electric Vehicle battery module interconnect system customizable to your requirements. Adaptable for various cell quantities and configurations with integrated control board connector and pluggable multi-module expansion capability.Customized Connectors
Design and development of interconnect solutions- our passion and forte. Discover our comprehensive range of customized connectors for various end applications, and the capabilities we have to provide you with Any solution, Anywhere™.Electronic Modules and Packaging Solutions
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.Flex Circuit Assembly with Custom Connector Solutions
From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.Flexible Busbars
Customized flexible busbars for low voltage power applications. Excellent vibration and shock absorption characteristics with improved electrical conductivity and high tolerance for assembly mismatch/offset.Heat Sinks
Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.IndiCoat™ Whisker Mitigation Plating Chemistry
Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.Interplex Corporate Brochure
Interplex specializes in customized applications solutions tailored to specific end-applications. Learn more about our global footprint, integrated full suite of capabilities, and the industries we excel in; discover how we can truly provide our valued customers with Any solution, Anywhere™.Mechatronics Packaging Interconnect Solutions
Customizable solutions with integrated pluggable sub-assemblies; suitable for high and low voltage power applications.Medical Circular Connectors: 10-pin/socket
Compact, robust and reliable 10-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Medical Circular Connectors: 6-pin/socket
Compact, robust and reliable 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Medical Circular Connectors: 6-pin/socket (Non-magnetic)
Compact, robust and reliable non-magnetic 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Multi-Row Board-to-Board Connector
Our robust Multi-Row Board-to-Board Connector is customizable to high circuit size, with board height flexibility. Up to 30 circuits per row and up to 6 rows.Open Cavity Thermoplastic Packaging Solutions
For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.Plating Capabilities
Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.Plating Research and Development Centre
Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.Power Interconnect Solutions
Learn more about our portfolio of customized interconnect solutions for electric & hybrid vehicles, e-mobility and industrial high-power applications.Press-Fit Current Carrying Capacity Datasheet
Electrical current carrying capacity data for Interplex’s 0.40mm MiniPLX, 0.64mm EON and 0.80mm EON Press-Fit zones.Press-Fit Technology
Your trusted solderless connection in various sizes, materials, plating options and delivery formats.Sinter-PLX™ Sinter-bonded Power Lead Frame Technology
Power lead frames with selective-bonded silver sinter for top side direct die attach. A stable and reliable solution with low inductance, low resistance and efficient heat dissipation.Solder and Flux Bearing Leads Catalogue
Interplex’s Solder and Flux Bearing Lead has a consistency close to 100% and contain a precise predetermined amount of solder and flux. Find drawings of our Solder and Flux Bearing Leads here.Solder and Flux Bearing Technology
Interplex’s Solder and Flux Bearing Technology eliminates costly and defect prone soldering methods and is an alternative for Press-Fits. Find drawings of our Solder and Flux Bearing Technology here.Solderless Capacitor Mount System – CAP-LOC™ System
A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.Solderless Press-Fit Terminals for Automotive Applications
Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.SPE Connector with Press-Fit & SPE Plug
As a member of the SPE Industrial Partner Network, we are committed to supplying a range of SPE products, such as IEC 63171-6 compliant connectors and receptacles.Automotive
- Battery Module Manufacturers Need Robust High-speed Options for Collector Plate Attachment
- Custom Battery Interconnect Systems Streamline Design Manufacturing Battery Modules
- Customized Connectors for ECU Modules in Automotive Applications
- Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs
- Integrating Custom Connectors is a Key Enabling Factor for Next-Gen Automotive Sensor Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies
Forging
- Advantages of Cold Forging vs Casting Processes
- Advantages of Cold Forging vs Machining
- Advantages of Cold Forging vs Weldments and other Fabrication Processes
- Cold Forging – Achieving a Variety of Shapes and Design Flexibility
- Cold Forging Improves Production Efficiency for Automotive Drivetrain Components
- Cold Forging Technology Offers Key Advantages
- Cold Forging Technology Offers Superior Strength, Part Integrity and Material Utilization
- Precision Cold Forging Progressive Stamping Enables Cost Effective Production of Complex Parts
Interconnect & Busbars
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- High Power Multi-layer Molded Busbars: Design Considerations and Construction Options
- New Busbar Technologies Provide Flexibility for Expanding Range of Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
Molding
- Creating Cost-Effective Sensor Housings with Integrated Molding and Wire Bondable Plated Stampings
- Design Considerations for Molded Plastic Electronic Modules Using Press-Fit Technology
- Integration of Insert Molding Processes to Optimize Production of Plastic Modules for Electronics, Sensors and Medical Applications
Power
- Bipolar Plates and Their Critical Role in Fuel Cells
- Custom Battery Interconnect Systems Streamline Design Manufacturing Battery Modules
- Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs
- New Busbar Technologies Provide Flexibility for Expanding Range of Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies
Press-Fit
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Enabling Next-Gen Power Applications With Improved Packaging Efficiency
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- New Hybrid Design 0.4mm Press-Fit Interconnects Enable Higher Density Applications
- Next Generation High Density SMT Solderless Edge Card Connector System
- Optimizing Molded Plastic Electronic Modules With Advanced Press-Fit Technologies
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 1 Application Requirements
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 2 Specifications & Design Considerations
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
Solder Bearing
- Key Issues and Considerations for Implementing Solder Bearing Lead Applications
- New Solder Attach Technologies Streamline Assembly in Application-Specific Designs
- New Solder Ball Technology Provides Enhanced Co-planarity Compensation for Module & Mezzanine Applications
- Solder-Bearing “Claw” Design Edge Clips – Getting a Grip for 100% Solderability
- Solder-Bearing Flex Circuit Contacts Enable Precise Temperature Control, Increased Yields, Streamlined Production and Higher Quality Results
- Solder-Bearing RF Shields Streamline PCB Assembly, Reduce Costs, Improve Quality and Eliminate Signal Leakage
Automotive Press-Fit Solderless Interconnects
Designed and tested to meet standard automotive requirements for vibration, mechanical and thermal shock for up to 125°C, as defined by the IEC, EIA and SAE.Bandolier Pins
Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.Bipolar Plates for Fuel Cells
Bipolar Plates for Fuel Cells- the heart of Hydrogen conversion into electric power. Green technology for various applications in the transportation and energy industries.BusMate® Power Busbar Connector System
Busbar-pluggable power interconnect for low and high voltage applications. Excellent ampacity-size ratio and accommodates large assembly tolerances.Cell-PLX™ Electric Vehicle Battery Interconnect System
Electric Vehicle battery module interconnect system customizable to your requirements. Adaptable for various cell quantities and configurations with integrated control board connector and pluggable multi-module expansion capability.Customized Connectors
Design and development of interconnect solutions- our passion and forte. Discover our comprehensive range of customized connectors for various end applications, and the capabilities we have to provide you with Any solution, Anywhere™.Electronic Modules and Packaging Solutions
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.Flex Circuit Assembly with Custom Connector Solutions
From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.Flexible Busbars
Customized flexible busbars for low voltage power applications. Excellent vibration and shock absorption characteristics with improved electrical conductivity and high tolerance for assembly mismatch/offset.Heat Sinks
Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.IndiCoat™ Whisker Mitigation Plating Chemistry
Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.Interplex Corporate Brochure
Interplex specializes in customized applications solutions tailored to specific end-applications. Learn more about our global footprint, integrated full suite of capabilities, and the industries we excel in; discover how we can truly provide our valued customers with Any solution, Anywhere™.Mechatronics Packaging Interconnect Solutions
Customizable solutions with integrated pluggable sub-assemblies; suitable for high and low voltage power applications.Medical Circular Connectors: 10-pin/socket
Compact, robust and reliable 10-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Medical Circular Connectors: 6-pin/socket
Compact, robust and reliable 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Medical Circular Connectors: 6-pin/socket (Non-magnetic)
Compact, robust and reliable non-magnetic 6-pin/socket circular connectors for the medical industry. UL controlled and certified, and REACH and RoHS 5/6 compliant.Multi-Row Board-to-Board Connector
Our robust Multi-Row Board-to-Board Connector is customizable to high circuit size, with board height flexibility. Up to 30 circuits per row and up to 6 rows.Open Cavity Thermoplastic Packaging Solutions
For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.Plating Capabilities
Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.Plating Research and Development Centre
Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.Power Interconnect Solutions
Learn more about our portfolio of customized interconnect solutions for electric & hybrid vehicles, e-mobility and industrial high-power applications.Press-Fit Current Carrying Capacity Datasheet
Electrical current carrying capacity data for Interplex’s 0.40mm MiniPLX, 0.64mm EON and 0.80mm EON Press-Fit zones.Press-Fit Technology
Your trusted solderless connection in various sizes, materials, plating options and delivery formats.Sinter-PLX™ Sinter-bonded Power Lead Frame Technology
Power lead frames with selective-bonded silver sinter for top side direct die attach. A stable and reliable solution with low inductance, low resistance and efficient heat dissipation.Solder and Flux Bearing Leads Catalogue
Interplex’s Solder and Flux Bearing Lead has a consistency close to 100% and contain a precise predetermined amount of solder and flux. Find drawings of our Solder and Flux Bearing Leads here.Solder and Flux Bearing Technology
Interplex’s Solder and Flux Bearing Technology eliminates costly and defect prone soldering methods and is an alternative for Press-Fits. Find drawings of our Solder and Flux Bearing Technology here.Solderless Capacitor Mount System – CAP-LOC™ System
A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.Solderless Press-Fit Terminals for Automotive Applications
Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.SPE Connector with Press-Fit & SPE Plug
As a member of the SPE Industrial Partner Network, we are committed to supplying a range of SPE products, such as IEC 63171-6 compliant connectors and receptacles.Automotive
- Battery Module Manufacturers Need Robust High-speed Options for Collector Plate Attachment
- Custom Battery Interconnect Systems Streamline Design Manufacturing Battery Modules
- Customized Connectors for ECU Modules in Automotive Applications
- Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs
- Integrating Custom Connectors is a Key Enabling Factor for Next-Gen Automotive Sensor Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies
Forging
- Advantages of Cold Forging vs Casting Processes
- Advantages of Cold Forging vs Machining
- Advantages of Cold Forging vs Weldments and other Fabrication Processes
- Cold Forging – Achieving a Variety of Shapes and Design Flexibility
- Cold Forging Improves Production Efficiency for Automotive Drivetrain Components
- Cold Forging Technology Offers Key Advantages
- Cold Forging Technology Offers Superior Strength, Part Integrity and Material Utilization
- Precision Cold Forging Progressive Stamping Enables Cost Effective Production of Complex Parts
Interconnect & Busbars
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- High Power Multi-layer Molded Busbars: Design Considerations and Construction Options
- New Busbar Technologies Provide Flexibility for Expanding Range of Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
Molding
- Creating Cost-Effective Sensor Housings with Integrated Molding and Wire Bondable Plated Stampings
- Design Considerations for Molded Plastic Electronic Modules Using Press-Fit Technology
- Integration of Insert Molding Processes to Optimize Production of Plastic Modules for Electronics, Sensors and Medical Applications
Power
- Bipolar Plates and Their Critical Role in Fuel Cells
- Custom Battery Interconnect Systems Streamline Design Manufacturing Battery Modules
- Integrated Thermal Management Solutions with Custom Manufacturable Heat Sink Designs
- New Busbar Technologies Provide Flexibility for Expanding Range of Applications
- New-Generation E-Mobility Traction Motor Stators are Enabled by Advanced Busbar Technologies
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Trends in Integrated Packaging – More Efficient Automotive Inverter Power Assemblies
Press-Fit
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Enabling Next-Gen Power Applications With Improved Packaging Efficiency
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- New Hybrid Design 0.4mm Press-Fit Interconnects Enable Higher Density Applications
- Next Generation High Density SMT Solderless Edge Card Connector System
- Optimizing Molded Plastic Electronic Modules With Advanced Press-Fit Technologies
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 1 Application Requirements
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 2 Specifications & Design Considerations
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
Solder Bearing
- Key Issues and Considerations for Implementing Solder Bearing Lead Applications
- New Solder Attach Technologies Streamline Assembly in Application-Specific Designs
- New Solder Ball Technology Provides Enhanced Co-planarity Compensation for Module & Mezzanine Applications
- Solder-Bearing “Claw” Design Edge Clips – Getting a Grip for 100% Solderability
- Solder-Bearing Flex Circuit Contacts Enable Precise Temperature Control, Increased Yields, Streamlined Production and Higher Quality Results
- Solder-Bearing RF Shields Streamline PCB Assembly, Reduce Costs, Improve Quality and Eliminate Signal Leakage
Instruction For Use (IFU)
Get to know your Interplex solution better. The complete manual and IFU accompanying selected solutions are available for your reference.
Click here to view our list of available IFUs.
Click here to view our list of available IFUs.