Press-Fit
A global leader in solderless Press-Fit Technology, Interplex has been producing Press-Fits for top-tier customers for over a decade. We are a global innovator, adapting Press-Fit technology for a wide range of industry-specific applications.
Unique Selling Proposition of Interplex’s Press-Fit Technologies
- High strength of Press-Fit joints eliminate fretting risks associated with pin and socket interconnects
- Reduced material costs (compared to pin and socket interconnects)
- Press-Fit joints are not subject to quality problems associated with solder – such as cold spots, voids, splatter and cracks
- Press-Fit parts are highly reliable and repeatable
- Press-Fit parts can be readily customized to enable package designers to meet their envelop and manufacturability targets
- Precious metals are not required
- Reduces or eliminates the need to perform secondary solder operations on printed circuit board (PCB) assemblies
- RoHS compliant
A Trusted Global Solutions Provider
Interplex’s Product Development team works closely with customers globally to develop Press-Fit solutions tailored to specific end application needs. For example: Direct insert terminals, customized connectors and headers, Press-Fit PCB connectors, custom-molded modules, power lead frames and other electronic packaging solutions.
We leverage our expertise in product design, applications engineering, manufacturing and automation to help customers create the proper turnkey solution for any particular application. Our global footprint vertically integrates Press-Fit stamping, plating, molding and assembly to provide the highest level of design flexibility, cost-effectiveness and production scalability.

Our Press-Fit Technology
Solderless Press-Fit Terminals for Automotive Applications
This technology supports the assembly of a terminal or electrical lead with a PCB plated-through hole, where an electrical connection is created and maintained without the application of solder.
Custom Connectors with Press-Fit Terminals
Our Press-Fit technology is used in connectors and headers that make custom interconnects directly from the PCB to a mating connector.
Press-Fit Module and Sensor Enclosures
Manufacturers utilize our solderless Press-Fit technology in a variety of control modules and sensors. Our technology helps customers design-in low-cost, high-quality products by seamlessly integrating the complete connection system into the enclosure package, eliminating the need for secondary soldering operations.
Card Edge SMT Press-Fit Connector System
Interplex’s SMT card edge connector system employs a discrete SMT component, creating a solderless Press-Fit card edge connector system for daughter card applications. It uses Interplex-tested and proven 0.4mm or 0.64mm Press-Fit technology. Automotive manufacturers utilize Press-Fit technology in control modules, switches, fuse receptacles, junction boxes, hybrid inverters, a myriad of sensor and connector applications, and other engine and passenger compartment applications. Our solderless Press-Fit technology is fully tested to meet the automotive industry’s stringent operating requirements for vibration and temperature.
Qualified to Industry Standards
Interplex is compliant to IEC 60352-5 industry specifications, and our Press-Fit technology is qualified to the specifications of the largest users of Press-Fit pins in the automotive industry.

Features of Our Press-Fit Technology
- Press-Fit zones: 0.4mm, 0.64mm, 0.8mm, 1.2mm
- Terminal sizes: Industry standard sizes (0.64mm, 1.5mm, 2.8mm, 6.3mm) and custom sizes are available
- Temperature: Qualified to 125°C and 150°C operational temperatures, with options up to 175°C
- High conductive material options from 13 – 80% IACS
- Compatible with tin, silver, gold and OSP circuit board finishes
- Designed for low or high-speed insertion
- Standard and high-performance alloy options
- Flexible tooling for low-cost variations
Our Portfolio
- 0.4mm MiniPLX™ Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- New Hybrid Design 0.4mm Press-Fit Interconnects Enable Higher Density Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 0.64mm Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 1.5mm Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 2-pin Press-Fit Header
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- 4-pin Press-Fit Header
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- Direct Insert Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- Dual-ended Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- What is the “right size” for Press-Fit – New Micro, Mini and Macro Press-Fits Support Applications in the Wearable, Medical and Industrial Markets
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- Fuel Level Sensor Connector
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- Press-Fit Header
- Interplex a Brochure
- Automotive Press-Fit Solderless Interconnects
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- https://interplex.com/app/uploads/2018/11/Press-Fit-Design-Testing-1.pdf
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
- SMT Press-Fit Pin
- Interplex Corporate Brochure
- Automotive Press-Fit Solderless Interconnects
- Plating Capabilities
- Press-Fit Technology
- Solderless Press-Fit Terminals for Automotive Applications
- Contact Resistance Analysis for Press-Fit Applications
- Determining PTH Integrity with Cross-Section Analysis
- Evaluation Checklist for Press-Fit Applications
- Mechanical Force Analysis for Press-Fit Applications
- Next Generation High Density SMT Solderless Edge Card Connector System
- PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
- Press-Fit Current Carrying Capacity – Part 1 Application Requirements
- Press-Fit Current Carrying Capacity – Part 2 Current Testing & Results
- Press-Fit Current Carrying Capacity – Part 3 Design Considerations for Power Modules
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 1 Application Requirements
- SMT Card-Edge Solutions Using Solderfree Press-Fit Technology – Part 2 Specifications & Design Considerations
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 1 Design, Testing & Documentation
- Supplier Best-Practices for Getting Results with Press-Fit Technology – Part 2 Global Production Standards, Materials, Tooling and Process Controls
- Upgrading Product Designs From Solderjoints to Press-Fit – Why, When and How
- Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
0.4mm MiniPLX™ Press-Fit Pin
Establishes solderless electro-mechanical board-to-board connection in EPS ECU.
Resources
0.64mm Press-Fit Pin
Establishes solderless electro-mechanical connection to PCB within sensor connector integrated in pedal unit, which transmits information related to pedal position for various functions in hybrid cars such as braking and start-stop functions, to name a few.
Resources
1.5mm Press-Fit Pin
Establishes solderless electro-mechanical connection to PCB within sensor connector integrated in pedal unit, which transmits information related to pedal position for various functions in hybrid cars such as braking and start-stop functions, to name a few.
Resources
2-pin Press-Fit Header
Establishes solderless electro-mechanical connection in crash sensor, which detects impact of crash and activates airbag inflation.
Resources
4-pin Press-Fit Header
Establishes solderless electro-mechanical connection in crash sensor, which detects impact of crash and activates airbag inflation.
Resources
Direct Insert Press-Fit Pin
Establishes solderless electro-mechanical connection to PCB for window switches.
Resources
Dual-ended Press-Fit Pin
Establishes solderless electro-mechanical connection between PCBs for rear view mirror.
Resources
Fuel Level Sensor Connector
Sensor connector for fuel level sensor, which measures how much fuel there is in fuel tank.
Resources
Press-Fit Header
Establishes solderless electro-mechanical connection to PCB for climate control system in center stack display.
Resources
Press-Fit Pin
Establishes solderless electro-mechanical connection to PCB for intake manifold temperature and pressure sensor.
Resources
Press-Fit Pin
Establishes solderless electro-mechanical connection to PCB of Body Control Module for control of power steering functions.
Resources
SMT Press-Fit Pin
Establishes robust 90° solderless electro-mechanical connection between PCBs in smart mirrors.