Solder Attach Technology
Over many years, solder attach technology, pioneered by Interplex, has been incorporated into a wide range of interconnects and other products by creating leads with a very precise amount of solder and flux already on them.
By considering the use of solder attach methods early in the design process, engineers can greatly expand their options for achieving product design and manufacturability objectives. Solder attach methods can be incorporated directly into the creation of virtually any application-specific components to make them “self-solderable”. This approach eliminates secondary processes and streamlines the assembly process, while also improving final product quality.
100% Solderability
Our solder-bearing and flux-bearing products have proven to deliver 100% solderability while eliminating expensive and variable secondary processes. This not only improves quality, but simultaneously reduces costs.
Customizable Designs
Interplex builds on these proven, fundamental solder attach technologies with our expertise in design and customized application solutions. Coupled with our vertically integrated manufacturing capabilities, we take pride in providing custom from-the-ground-up designs that deliver 100% solderability within a widening range of application-specific product implementations.
Global Footprint
The flexibility of solder attach technologies, combined with our global footprint and customization expertise, makes this technology an ideal alternative for new custom applications that require joining of components within tight tolerances. Top-tier customers trust in the reliability of our self-soldering solutions, all while keeping costs competitive.
Types of Applications
- Automotive electronics
- Datacom & Telecom devices
- Display panels
- Lead frames
- Medical & Life Sciences devices
- Radio frequency shielding
- Sensors
Our Portfolio
- 1.905mm Solder and Flux Bearing Edge Clip
- Interplex Corporate Brochure
- Electronic Modules and Packaging Solutions
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Key Issues and Considerations for Implementing Solder Bearing Lead Applications
- New Solder Attach Technologies Streamline Assembly in Application-Specific Designs
- Solder-Bearing “Claw” Design Edge Clips – Getting a Grip for 100% Solderability
- Solder-Bearing Flex Circuit Contacts Enable Precise Temperature Control, Increased Yields, Streamlined Production and Higher Quality Results
- 3.5mm Solder and Flux Bearing Edge Clip
- Interplex Corporate Brochure
- Electronic Modules and Packaging Solutions
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Key Issues and Considerations for Implementing Solder Bearing Lead Applications
- New Solder Attach Technologies Streamline Assembly in Application-Specific Designs
- Solder-Bearing Flex Circuit Contacts Enable Precise Temperature Control, Increased Yields, Streamlined Production and Higher Quality Results
- Solder-Bearing “Claw” Design Edge Clips – Getting a Grip for 100% Solderability
- 5.1mm Solder and Flux Bearing Edge Clip
- Interplex Corporate Brochure
- Electronic Modules and Packaging Solutions
- Advanced Interconnect Designs to Optimize High-Mix Production Environments
- Key Issues and Considerations for Implementing Solder Bearing Lead Applications
- New Solder Attach Technologies Streamline Assembly in Application-Specific Designs
- Solder-Bearing Flex Circuit Contacts Enable Precise Temperature Control, Increased Yields, Streamlined Production and Higher Quality Results
- Solder-Bearing “Claw” Design Edge Clips – Getting a Grip for 100% Solderability
1.905mm Solder and Flux Bearing Edge Clip
Connects and transmits electrical signals from sensor die to analogue-to-digital converter chip of pressure transducer, which controls the vacuum required for exhaust gas recirculation valve.
Resources
3.5mm Solder and Flux Bearing Edge Clip
Transmits electricity within circuits of igniter modules for High Intensity Discharge headlights
Resources
5.1mm Solder and Flux Bearing Edge Clip
Transmits electricity within circuits of igniter modules for High Intensity Discharge headlights.