Interplex offers complete solutions from concept through development and into scalable high-volume production of electronic modules for almost any electronic packaging application. Our dedicated team of engineers develop innovative solutions that fit the manufacturing needs of our valued customers, and thereafter match up those needs with the most suitable Interplex production facility.
Today, we continue to expand our technologies and capabilities from developing solutions for high-speed data and micro-electronic packaging requirements to high-current, thermally-efficient packaging for power generation and conversion in electronic module applications such as radio frequency power and hybrid technologies.
Types of Applications
- Component holders
- Ceramic interconnects
- Power modules
- Radio frequency, hybrid, converters and solar devices
- Semiconductor packages
- Sensor enclosures
- Tire Pressure Monitor System (TPMS) Sensors
- Ultraviolet and light detectors