Electronic Modules & Packages

 

 

Technology & Innovation

Electronic Modules & Packages

 

 

 

Interplex offers complete solutions from concept through development and into scalable high-volume production of electronic modules for almost any electronic packaging application. Interplex’s network of engineers develop solutions that fit the manufacturing needs of our customers and then match up those needs with the best Interplex production facility.

Today, Interplex continues to expand its technologies and capabilities from developing solutions for high-speed data and micro-electronic packaging requirements to high-current, thermally efficient packaging for power generation and conversion in electronic modules’ applications such as RF Power and Hybrid technologies. Interplex is always driven by the singular mission to deliver innovative solutions and services to our customers.

 

Types of Applications:
  • Sensor Housings
  • RF, Hybrid, Converters & Solar Devices
  • UV & Light Detectors
  • Power Modules
  • Tire Pressure Housings
  • Component Holders
  • Ceramic Interconnects
  • Microelectronics
  • Semiconductor Packages
Markets:
  • Automotive
  • Consumer Electronics
  • Industrial
  • Medical
Types of Packages / Services Available:
Die and Wire-Bondable Electronic Packages
  •  Sensor Connector Housings
  • Power Electronics
  • Temperature Sensors
  • Motor Controllers
  • Power Leadframes
  • Pressure & Vacuum
  • Wire-bondable Ag, Ni, Pd, Au, NiP Platings
  • Metal or Plastic Die Paddles
  • Reel to Reel options
  • Ductile Thermal Heat Spreaders
Semiconductor Electronic Packages
  • MEMS
  • CPV Solar
  • Pressure & Motion
  • RF Power
  • UV Detectors
  • LED
  • Multi-Chip
  • High Power
  • Photonic
  • High Temperature LCP Plastic
  • Metal or Plastic Die Paddle
  • Reel to Reel
  • Wire-bondable
  • Copper Base Flange Technology
  • SMT, Through-Hole
Solder Bearing Interconnect Products
  • Microelectronics
  • Multichip Modules
  • Memory Modules
  • Ceramic Interconnects
  • Sensor Assemblies
  • Large Variety of Solder Types
  • CTE Mismatch Compliant
  • Reel to Reel for Automation
  • Zip, SIP, Zig-Zag Configurations
  • Connectors
PCB Interface, Press-Fit and Bondable Electronic Packages
  • Position Sensors
  • Motor Drivers
  • Starters
  • Intake Manifold
  • Controllers
  • TPMS Sensors
  • Press-Fit/Compliant Technology
  • Wire-bondable Connections
  • Tuning Forks and Sockets
  • High Temp. Alloys & Plastic Options
  • High Current Options
  • I/O Connector Options
  • Continuous Plastic Assemblies and Component Holders
  • Bobbin Assemblies
  • Flex Circuit Assemblies
  • Pressure Sensors
  • Capacitor Holders
  • Telecom Jacks
  • Relays
  • Reel to Reel
  • SMT or Connector Interface
  • Custom & Select Plating Options
  • Metal Etched and Stamped Options
Engineering and Development
  • Application Expertise and Design Assistance
  • FEA Evaluation
  • Design Validation & Product Development
  • Design for Global Manufacturing
  • Packaging Integration
  • Production Tool Design and Build
  • Quick Turn Prototypes