Solder Attach Technology

 

 

Technology & Innovation

Solder Attach Technology

 

 

 

Over many years, Solder Attach Technology, pioneered by Interplex, has been incorporated into a wide range of interconnects and other products by creating leads with a very precise amount of solder and flux already on them.

100% Solderability

These solder-bearing and flux-bearing products have proven to deliver 100 percent solderability while eliminating expensive and variable secondary processes, thereby improving quality while simultaneously reducing costs.

Customizable Design

Building on these fundamental proven Solder Attach Technologies in combination with our internal design expertise and vertical manufacturing capabilities, Interplex also provides custom from-the-ground-up designs to deliver 100 percent solderability and cost reduction within a widening range of application-specific product implementations.

Global Footprint

Interplex’s global supplier footprint and the flexibility of Solder Attach technologies, combined with custom stamping capabilities, makes the technology an ideal alternative for creating any new custom applications that require joining together of components within tight tolerances at low cost while providing high reliability.

Interplex self-soldering solutions are key enabling technologies for industries such as:

  • Automotive Electronics
  • Medical Devices
  • Telecom and Mobile Devices
  • RF Shielding
  • Sensors
  • Lead Frames
  • Display panels
  • Custom Applications

By considering the use of Solder Attach methods early in the design process, engineers can greatly expand their options for achieving product design and manufacturability objectives. Solder Attach methods can be incorporated directly into the creation of virtually any application-specific components to make them “self-solderable”. This approach eliminates secondary processes and streamlines the assembly process, while also improving final product quality.