Brochures

Our plating Centre of Excellence established in BioCity in central Scotland is well-equipped with state-of-the-art equipment to provide a comprehensive suite of laboratory testing services.

Learn more about our global plating capabilities: Reel-to-reel (selective, spot and stripe) plating, rack and barrel plating, and other surface treatment processes.

Developed by Interplex, IndiCoat™ whisker mitigation plating chemistry is already in production mode for our Press-Fit pins. Depending on end-applications and specifications required, a combination of undercoat barrier layers and/or specific topcoats can be used as whisker mitigation strategies.

Customized thermal solutions for high-power applications. Our integrated stamping and joining processes produce heat sinks with impressive weight savings, and enable design freedom for fin dimensions and configurations, and 3D individualizable fin characteristics.

Our modular high-speed production dies can be configured for specific blade lengths and tip geometries to provide you with fast and economical product development cycles.

A solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives, or clamps commonly used to make the electrical and mechanical connections to PCBs.

For applications such as automotive sensors and modules, semiconductor leadframes, consumer electronics, telecom amplifiers, industrial controls, military avionics and medical devices.

From concept development to high volume production, Interplex Sunbelt Inc. offers design services that focus on “design for manufacturability” Flex Circuit Assemblies with quick turn prototyping during the early stages of your program.

Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application.

Bandolier Pins and Terminals made from open tooling, in a wide variety of sizes.